Hybridization Mechanical Engineer Full Time

Hybridization Mechanical Engineer – Semiconductor Research Lab  

We specialize in providing a broad range of high technology solutions and products to the marketplace. Imaging Sensors provides advanced imaging solutions for a variety of customers, including the DoD, NASA, prime system integrators, and commercial customers. In the civilian space arena, our sensors are the most advanced sensors on board the Hubble space telescope, and they are also found on board the majority of NASA space probes and ground based telescopes. In the DoD arena, our sensors are integrated into several major systems for persistent surveillance, chemical detection, and target identification, among others.

Position Summary and Responsibilities:

It is a hands-on position for executing and supporting the manufacturing activities of infrared and visible focal plane array (FPA) assemblies. The engineer would provide technical (production and development) leadership in the FPA fabrication process and would work regularly alongside the FPA production team in the cleanroom. The engineer would be responsible for the execution of flip-chip bonding across all programs.

Essential Duties and Responsibilities:

• Determines conditions for various processes, including etching, flip-chip bonding, polishing, and AR coating.
• Reviews components and assembly designs to optimize producibility.
• Determines tooling needed for production.
• Determines and tracks the key process controls/measurements needed to verify success and to meet assembly specifications.
• Prepares and presents workflows, work instructions, and Manufacturing Readiness review charts.
• Works with cleanroom staff to fabricate prototype parts.
• Trains operators in the use of documentation and tooling.
• Tracks issues as they arise and leads teams to solving them.
• Oversees inspections, data analysis, and documentation.
• Frequently works with Enterprise Resource Planning (ERP) system for tracking and reporting of data
• Contribute to manufacturing trouble shooting and conduct failure analysis and identify root causes.
• Manages efforts in the development and execution of a risk management plan during the design and fabrication of focal plane arrays

Qualifications

• To perform the job successfully, an individual should demonstrate the following qualifications and competencies:
• Knowledge of flip-chip bonding and assembly processes, including epoxy bonding, polishing, substrate removal and Anti-Reflection Coating.
• Strong background in opto-electronic semiconductor devices or similar area of knowledge
• Experience in DOE, product and technology development
• Experience in project management, risk assessment/management, cost account management, cost estimation and engineering planning is highly desired
• Effective communication (written and verbal) of very complex ideas and the ability to communicate at any level of audience
• Strong technical writing and communication skills are required to complete whitepapers, proposals, technical reports and support customer reviews
• Advanced computer proficiency using Microsoft Office Suite (Word, Excel & PowerPoint)
• Displays exemplary ethics and business conduct and performs work cognizant of safe work practices

Education

• Master’s Degree with five (5) years of experience; or equivalent combination of education and experience